Saxo Access
Indkøbskurv

Lau, John H.

Vis søgefilter

Vis mig kun

Through-Silicon Vias for 3D Integration

Through-Silicon Vias for 3D Integration

Lau, John H.

1094,57 DKK

Through-Silicon Vias for 3D Integration

Through-Silicon Vias for 3D Integration

Lau, John H.

1094,57 DKK

3D IC Integration and Packaging

3D IC Integration and Packaging

Lau, John H.

1240,73 DKK

Chiplet Design and Heterogeneous Integration Packaging

Chiplet Design and Heterogeneous Integration Packaging

Lau, John H.

1313,81 DKK

Chiplet Design and Heterogeneous Integration Packaging

Chiplet Design and Heterogeneous Integration Packaging

Lau, John H.

1313,81 DKK

Semiconductor Advanced Packaging

Semiconductor Advanced Packaging

Lau, John H.

948,41 DKK

Semiconductor Advanced Packaging

Semiconductor Advanced Packaging

Lau, John H.

948,41 DKK

Heterogeneous Integrations

Heterogeneous Integrations

Lau, John H.

1167,65 DKK

Heterogeneous Integrations

Heterogeneous Integrations

Lau, John H.

1167,65 DKK

Fan-Out Wafer-Level Packaging

Fan-Out Wafer-Level Packaging

Lau, John H.

802,25 DKK

Reliability of RoHS-Compliant 2D and 3D IC Interconnects

Reliability of RoHS-Compliant 2D and 3D IC Interconnects

Lau, John H.

1021,49 DKK

Reliability of RoHS-Compliant 2D and 3D IC Interconnects

Reliability of RoHS-Compliant 2D and 3D IC Interconnects

Lau, John H.

1021,49 DKK

3D IC Integration and Packaging

3D IC Integration and Packaging

Lau, John H.

1240,73 DKK