Mai, Y.-W.

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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

Mai, Y.-W.

1313,81 DKK

Science and Engineering of Short Fibre Reinforced Polymer Composites

Science and Engineering of Short Fibre Reinforced Polymer Composites

Mai, Y.-W.

25,00 DKK

Science and Engineering of Short Fibre Reinforced Polymer Composites

Science and Engineering of Short Fibre Reinforced Polymer Composites

Mai, Y.-W.

25,00 DKK

Science and Engineering of Short Fibre-Reinforced Polymer Composites

Science and Engineering of Short Fibre-Reinforced Polymer Composites

Mai, Y.-W.

2190,77 DKK

Science and Engineering of Short Fibre-Reinforced Polymer Composites

Science and Engineering of Short Fibre-Reinforced Polymer Composites

Mai, Y.-W.

2190,77 DKK

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

Mai, Y.-W.

1313,81 DKK

Physical Properties and Applications of Polymer Nanocomposites

Physical Properties and Applications of Polymer Nanocomposites

Mai, Y.-W.

2190,77 DKK

Physical Properties and Applications of Polymer Nanocomposites

Physical Properties and Applications of Polymer Nanocomposites

Mai, Y.-W.

2190,77 DKK