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  3. Area Array Packaging Handbook: Manufacturing and Assembly
Area Array Packaging Handbook: Manufacturing and Assembly (e-bog) af Gilleo, Ken
Gilleo, Ken (forfatter)

Area Array Packaging Handbook: Manufacturing and Assembly e-bog

948,41 DKK (inkl. moms 1185,51 DKK)
*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)
E-bog 948,41 DKK
Kan læses i vores apps til iPhone/iPad og Android.
Forfattere Gilleo, Ken (forfatter)
Forlag McGraw Hill
Udgivet 26 november 2001
Længde 1000 sider
Genrer KNTR
Sprog English
Format pdf
Beskyttelse LCP
ISBN 9780071500654

Beskrivelse

*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)