Dansk
Koester, Steven J.
(redaktør)
3D Integration for VLSI Systems e-bog
1021,49 DKK
Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th
E-bog
1021,49 DKK
Forlag
Jenny Stanford Publishing
Udgivet
19.04.2016
Længde
350 sider
Genrer
Physics
Sprog
English
Format
epub
Beskyttelse
LCP
ISBN
9781040000106
Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th