Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture e-bog
1313,81 DKK
(inkl. moms 1642,26 DKK)
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. ...
E-bog
1313,81 DKK
Forlag
Woodhead Publishing
Udgivet
23 maj 2015
Længde
482 sider
Genrer
TGB
Sprog
English
Format
epub
Beskyttelse
LCP
ISBN
9780857099112
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. Discusses how the reliability of packaging components is a prime concern to electronics manufacturers Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques Includes program files and macros for additional study