Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture (e-bog) af Mai, Y.-W.
Mai, Y.-W. (forfatter)

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture e-bog

1313,81 DKK (inkl. moms 1642,26 DKK)
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. ...
E-bog 1313,81 DKK
Forfattere Mai, Y.-W. (forfatter)
Udgivet 23 maj 2015
Længde 482 sider
Genrer TGB
Sprog English
Format epub
Beskyttelse LCP
ISBN 9780857099112
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. Discusses how the reliability of packaging components is a prime concern to electronics manufacturers Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques Includes program files and macros for additional study