Dansk
Advanced Flip Chip Packaging e-bog
1167,65 DKK
(inkl. moms 1459,56 DKK)
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer bette...
E-bog
1167,65 DKK
Forlag
Springer
Udgivet
20 marts 2013
Genrer
TGMM
Sprog
English
Format
pdf
Beskyttelse
LCP
ISBN
9781441957689
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.