Advanced Wirebond Interconnection Technology e-bog
2921,57 DKK
(inkl. moms 3651,96 DKK)
Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not the least, operator training. This book is intended to be a comprehensive source of information a...
E-bog
2921,57 DKK
Forlag
Springer
Udgivet
10 maj 2006
Genrer
TGMM
Sprog
English
Format
pdf
Beskyttelse
LCP
ISBN
9781402077630
Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not the least, operator training. This book is intended to be a comprehensive source of information and knowledge that enables both a newcomer to the field and a veteran who needs instant information to make a decision on a process problem. The book explains not only how to do things such as: designing a bond pad or a lead finger, how to select a right bond wire, how to design a capillary and how to optimize a bonding process on the factory floor; but the book also explains why to do it that way.