Nano Interconnects e-bog
1021,49 DKK
(inkl. moms 1276,86 DKK)
This textbook comprehensively covers on-chip interconnect dimension and application of carbon nanomaterials for modeling VLSI interconnect and buffer circuits.It provides analysis of ultra-low power high speed nano-interconnects based on different facets such as material modeling, circuit modeling and the adoption of repeater insertion strategies and measurement techniques. It covers important ...
E-bog
1021,49 DKK
Forlag
CRC Press
Udgivet
23 december 2021
Længde
216 sider
Genrer
TJFC
Sprog
English
Format
epub
Beskyttelse
LCP
ISBN
9781000504316
This textbook comprehensively covers on-chip interconnect dimension and application of carbon nanomaterials for modeling VLSI interconnect and buffer circuits.It provides analysis of ultra-low power high speed nano-interconnects based on different facets such as material modeling, circuit modeling and the adoption of repeater insertion strategies and measurement techniques. It covers important topics including on-chip interconnects, interconnect modeling, electrical impedance modeling of on-chip interconnects, modeling of repeater buffer and variability analysis. Pedagogical features including solved problems and unsolved exercises are interspersed throughout the text for better understanding.Aimed at senior undergraduate and graduate students in the field of electrical engineering, electronics and communications engineering for courses on Advanced VLSI Interconnects/Advanced VLSI Design/VLSI Interconnects/VLSI Design Automation and Techniques, this book:Provides comprehensive coverage of fundamental concepts related to nanotube transistors and interconnects.Discusses properties and performance of practical nanotube devices and related applications.Covers physical and electrical phenomena of carbon nanotubes, as well as applications enabled by this nanotechnology.Discusses the structure, properties, and characteristics of graphene-based on-chip interconnect.Examines interconnect power and interconnect delay issues arising due to downscaling of device size.