Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement e-bog
436,85 DKK
(inkl. moms 546,06 DKK)
As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including elec...
E-bog
436,85 DKK
Forlag
CRC Press
Udgivet
8 marts 2019
Længde
226 sider
Genrer
TJFC
Sprog
English
Format
pdf
Beskyttelse
LCP
ISBN
9780429680076
As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.