Silicon-on-Sapphire Circuits and Systems (e-bog) af Culurciello, Eugenio
Culurciello, Eugenio (forfatter)

Silicon-on-Sapphire Circuits and Systems e-bog

1459,56 DKK (ekskl. moms 1167,65 DKK)
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.The Latest Silicon-on-Sapphire CMOS Design and Fabrication TechniquesDevelop high-performance SOS-based microsystems. Filled with examples, schematics, and charts, Silicon-on-Sapphire Circuits and Systems cove...
E-bog 1459,56 DKK
Forfattere Culurciello, Eugenio (forfatter)
Forlag McGraw Hill
Udgivet 8 september 2009
Længde 416 sider
Genrer TJFC
Sprog English
Format pdf
Beskyttelse LCP
ISBN 9780071608497
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.The Latest Silicon-on-Sapphire CMOS Design and Fabrication TechniquesDevelop high-performance SOS-based microsystems. Filled with examples, schematics, and charts, Silicon-on-Sapphire Circuits and Systems covers the latest analog and mixed-signal IC design techniques.Learn how to assemble SOI/SOS circuits and systems, work with an insulated substrate and device models, create miniaturized amplifiers and switches, and build ADCs and DACs. You will also find information on constructing photosensitive circuits and memory chips, deploying integrated biosensors, overcoming noise and power issues, and maximizing efficiency. Discover how to:Extract active and passive device models and parametersDesign single-stage amplifiers, op amps, references, and comparatorsBuild digital processors, data converters, and mixed-mode circuitsDeploy photodetectors in active pixel sensor and imaging arraysOptimize performance, quantum efficiency, and signal-to-noise ratioDevelop current and voltage mode SOS-based biosensorsUse CMOS, monolithic, and digital phase-shift isolation techniquesIntegrate the latest three-dimensional assemblies and die packages