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  3. Design And Modeling For 3d Ics And Interposers
Design And Modeling For 3d Ics And Interposers (e-bog) af Ki Jin Han, Han
Ki Jin Han, Han (forfatter)

Design And Modeling For 3d Ics And Interposers e-bog

366,80 DKK (inkl. moms 458,50 DKK)
3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numer...
E-bog 366,80 DKK
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Forfattere Ki Jin Han, Han (forfatter)
Forlag World Scientific
Udgivet 5 november 2013
Længde 380 sider
Genrer TJFD5
Sprog English
Format pdf
Beskyttelse LCP
ISBN 9789814508612

Beskrivelse

3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.